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power management & multimarket data sheet revision 1.0, 2016-04-22 final ESD230-B1-W0201 bi-directional, 5.5 v, 7 pf, 0201, rohs and halogen free compliant quality requirement category: standard ESD230-B1-W0201 tvs diode tvs (transient voltage suppressor)
edition 2016-04-22 published by infineon technologies ag 81726 munich, germany ? 2016 infineon technologies ag all rights reserved. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ) warnings due to technical requirements, components may contain dangerous substances. for in formation on the types in question, please contact the neares t infineon technologies office. infineon technologies components may be used in life-suppo rt devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or sys tem. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if t hey fail, it is reasonable to assume that the health of the user or other persons may be endangered.
ESD230-B1-W0201 product overview final data sheet 3 revision 1.0, 2016-04-22 1 product overview 1.1 features guidelines for optimized pcb design and assembly process available [2] 1.2 application examples ? esd protection of highly susceptible ic/asics in audio, headset, human digital interfaces ? dedicated solution to boost space saving and hi gh performance in miniaturized modern electronics 1.3 product description figure 1-1 pin configurati on and schematic diagram ? esd / transient protection of high speed data lines according to: ? iec61000-4-2 (esd): 16 kv (air/contact discharge) ? iec61000-4-4 (eft): 2kv / 40 a (5/50 ns) ? iec61000-4-5 (surge): 3 a (8/20 s) ? bi-directional working voltage up to: v rwm =5.5v ? line capacitance: c l = 7 pf (typical) at f =1mhz ? clamping voltage: v cl =13v (typical) at i tlp =16a with r dyn =0.22 ? (typical) ? very low reverse current: i r <1na (typical) ? minimized clamping overshoot due to extremely low parasitic inductance ? small form factor smd size 0201 and low profile (0.58 mm x 0.28 mm x 0.15 mm) ? bidirectional and symmetric i/v characte ristics for optimized design and assembly ? pb-free (rohs compliant) and halogen free package table 1-1 part information type package configuration marking code ESD230-B1-W0201 wll-2-1 1 line, bi-directional a 1) 1) the device does not have any markin g or date code on the device backside. the marking code is on pad side. configuration _schematic_diagram.vst.vsd b) schematic diagram a) pin configuration top view
ESD230-B1-W0201 maximum ratings final data sheet 4 revision 1.0, 2016-04-22 2 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 3 electrical characteristics figure 3-1 definitions of electrical characteristics table 2-1 maximum ratings at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit reverse working voltage v rwm 5.5 v esd (air / contact) discharge 2) 2) v esd according to iec61000-4-2 ( r =330 ? , c = 150 pf discharge network) v esd 16 kv peak pulse power 3) p pk 56 w peak pulse current 3) 3) stress pulse: 8/20 s current waveform according to iec61000-4-5 i pp 3 a operating temperature range t op -55 to 125 c storage temperature t stg -65 to 150 c

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ESD230-B1-W0201 electrical characteristics final data sheet 5 revision 1.0, 2016-04-22 table 3-1 dc characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. breakdown voltage v br 6.05 8 ? v i t =1ma reverse current i r ??100na v r =5.5v table 3-2 rf characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l ?711pf v r =0v, f =1mhz ?7? v r =0v, f =1ghz table 3-3 esd and surge characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. clamping voltage 2) 2) please refer to application note an210 [1] . tlp parameter: z 0 = 50 , t p = 100ns, t r = 0.6 ns. v cl - - 10.5 v i tlp =1a, t p =100ns --15 i tlp =16a, t p =100ns clamping voltage 3) 3) stress pulse: 8/20 s current waveform according to iec61000-4-5 - - 11.3 i pp =1a, t p =8/20s --14 i pp =3a, t p =8/20s dynamic resistance 2) r dyn -0.22- ? t p = 100 ns
ESD230-B1-W0201 typical characteristics diagrams final data sheet 6 revision 1.0, 2016-04-22 4 typical characteristics diagrams typical characteristics diagrams at t a = 25c, unless otherwise specified figure 4-1 reverse leakage current: i r = f ( v r ) figure 4-2 line capacitance: c l = f ( v r ) 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 -5 -4 -3 -2 -1 0 1 2 3 4 5 i r [a] v r [v] 0 1 2 3 4 5 6 7 8 9 10 0 0.5 1 1.5 2 2.5 3 c l [pf] v r [v] 1 mhz 1 ghz
ESD230-B1-W0201 typical characteristics diagrams final data sheet 7 revision 1.0, 2016-04-22 figure 4-3 clamping voltage (esd): v cl = f ( t ), 8 kv positive pulse figure 4-4 clamping voltage (esd) v cl = f ( t ), 8 kv negative pulse -5 0 5 10 15 20 25 30 35 40 45 50 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 25 v v cl-30ns-peak = 12 v -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -24 v v cl-30ns-peak = -11 v
ESD230-B1-W0201 typical characteristics diagrams final data sheet 8 revision 1.0, 2016-04-22 figure 4-5 clamping voltage (esd) v cl = f ( t ), 15 kv positive pulse figure 4-6 clamping voltage (esd) v cl = f ( t ), 15 kv negative pulse -5 0 5 10 15 20 25 30 35 40 45 50 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 34 v v cl-30ns-peak = 13 v -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -35 v v cl-30ns-peak = -12 v
ESD230-B1-W0201 typical characteristics diagrams final data sheet 9 revision 1.0, 2016-04-22 figure 4-7 clamping voltage (tlp): i tlp = f ( v tlp ) [1] -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 -20 -15 -10 -5 0 5 10 15 20 -15 -12.5 -10 -7.5 -5 -2.5 0 2.5 5 7.5 10 12.5 15 i tlp [a] equivalent v iec [kv] v tlp [v] ESD230-B1-W0201 r dyn r dyn = 0.22 r dyn = 0.22
ESD230-B1-W0201 typical characteristics diagrams final data sheet 10 revision 1.0, 2016-04-22 figure 4-8 clamping voltage (surge): i pp = f ( v cl ) [1] -4 -3 -2 -1 0 1 2 3 4 -15 -10 -5 0 5 10 15 i pp [a] v cl [v]
ESD230-B1-W0201 typical characteristics diagrams final data sheet 11 revision 1.0, 2016-04-22 figure 4-9 insertion loss vs. frequency in a 50 ? system -35 -30 -25 -20 -15 -10 -5 0 10 100 1000 10000 insertion loss [db] f [mhz] esd230-b1- w 0201
ESD230-B1-W0201 package final data sheet 12 revision 1.0, 2016-04-22 5 package figure 5-1 wll-2-1 package outline (dimension in mm) figure 5-2 wll-2-1 footprint (dimension in mm)recommendation for printed circuit board assembly [2] figure 5-3 wll-2-1 packing (dimension in mm) figure 5-4 wll-2-1 marking example, type code see: table 1-1 ?part information? on page 3 sg-wll-2-1-po v01 0.03 0.28 0.01 0.15 1 2 0.02 0.2 0.58 0.03 0.02 0.26 bottom view top view 0.36 (0.16) 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 2 0.23 sg-wll-2-1-tp v02 0.35 0.21 0.68 8 deliveries can be in embossed tape with or without vacuum hole (no selection possible). specification allows identical processing (pick & place) by users. sg-wll-2-1-mk v03 1 1 type code 1 1 type code marking on pad-side
ESD230-B1-W0201 references final data sheet 13 revision 1.0, 2016-04-22 references [1] infineon ag - application note an210: effective esd protection design at system level using vf-tlp characterization methodology [2] infineon ag - recommendation for printed ci rcuit board assembly of infineon wll packages [3] infineon ag - application note an392: tvs diodes in chip scale package reduce size and save cost http://www.infineon.com/dgdl/?fileid=db3a304344f7b4f9014503db540027c0 ??
ESD230-B1-W0201 final data sheet 14 revision 1.0, 2016-04-22 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 revision history: page or item subjects (major changes since previous revision) revision 1.0, 2016-04-22
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